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The Self-assembly of Heterocyclic Selenium Compounds (4,5-Benzopiaselenol) on Gold
Zheng Wenjie*,Zeng Xinhua,Bai Yan,Yang Fang,Ouyang Jianming
Author NameAffiliationE-mail
Zheng Wenjie* Department ofChemistry, Jinan University, Guangzhou 510632 tzhwj@jnu.edu.cn 
Zeng Xinhua Department ofChemistry, Jinan University, Guangzhou 510632  
Bai Yan Department ofChemistry, Jinan University, Guangzhou 510632  
Yang Fang Department ofChemistry, Jinan University, Guangzhou 510632  
Ouyang Jianming Department ofChemistry, Jinan University, Guangzhou 510632  
Abstract:
To find a new system of self-assembled monolayers (SAMs) and to build up new founctions, the SAMs of heterocyclic selenium compounds (piaselenol, with macrocyclic conjugated plane molecule structure) on gold surface were investigated. The SAMs of piaselenol were characterized by X-ray photoelectron spectroscopy (XPS) and cyclic voltammetry. The results of XPS showed that the binding energy of Se3d changed from57.4 eV to 57.1 eV, which proved that the gold surface had been assembled with piaselenol molecules. The results of cyclic voltammetry showed that the peaks of the oxidation and reduction of Fe(CN)63-/4-almost disappeared after the self-assembly. The reduction peak potential of the self-assembled piaselenol on gold was -0.66 V in the Na2B4O7solution, which was close to the potential of bare gold in piaselenol solution. The electron transfer mechanism about SAMs of organoselenium compounds on the gold surface was also discussed.
Key words:  Heterocyclic selenium compound, Piaselenol, Self-assembled, Monolayers, Cyclic voltammetry
FundProject:国家自然科学基金(20271022)、广东省自然科学基金资助项目(010369).
硒杂环化合物(4,5-苯并苤硒脑)在金表面上的自组装
郑文杰*,曾鑫华,白燕,杨芳,欧阳健明
摘要:
为了寻求新的自组装单分子膜体系,构建新的功能膜,研究了具备平面型的大环共轭硒杂环化合物-- 4,5-苯并苤硒脑(苯并[c]硒二唑,简称苤硒脑)在金表面的自组装单分子膜.通过X射线光电子能谱(XPS)和电化学手段对其进行表征.XPS研究结果表明,自组装形成单分子膜后,苤硒脑分子中Se3d结合能从57.4 eV下降到57.1 eV;表明硒杂环化合物是通过金硒键固定在金表面上的;电化学循环伏安法实验表明,金电极表面上自组装该有机硒后, Fe(CN)63-/4-的氧化还原峰几乎完全消失;以四硼酸钠为底液,测得该化合物自组装在金表面上时,其还原电位在-0.66 V,与在溶液中用裸金电极测得的还原峰电位基本一致.
关键词:  硒杂环化合物  苤硒脑  自组装  循环伏安
DOI:10.1088/1674-0068/15/6/461-464
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