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Synthesis of Silica Particles with Precisely Tailored Diameter
Lei Pan,Yi Wang,Hong-bo Xu,Yan-bo Ding,Yao Li*,Jiu-peng Zhao*
Author NameAffiliationE-mail
Lei Pan Center for Composite Materials and Structures, Harbin Institute of Technology, Harbin 150080, China  
Yi Wang Center for Composite Materials and Structures, Harbin Institute of Technology, Harbin 150080, China  
Hong-bo Xu School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 150001, China  
Yan-bo Ding School of New Energy, Shenyang Institute of Engineering, Shenyang 110136, China  
Yao Li* Center for Composite Materials and Structures, Harbin Institute of Technology, Harbin 150080, China yaoli@hit.edu.cn 
Jiu-peng Zhao* School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 150001, China jiupengzhao@126.com 
Abstract:
A modified seeded growth process of silica particles with a continuous addition of tetraethyl orthosilicate (TEOS) was presented to control the diameter of silica particles. The diameter of particles was monitored by dynamic light scattering to control the addition of TEOS. The increase in the diameter of the silica particles with time and the addition of TEOS was investigated. The diameter of silica seeds increased from 193 nm to 446 nm in 4 h. The final diameter of silica particles was tailored within the range of ±5 nm to the target diameter. Silica particles with diameter of 446 nm were synthesized and assembled into photonic crystals with a pseudo band gap centered at just 1000 nm. The feasibility and practicability of this modified seeded growth process was verified.
Key words:  Silica particle, Dynamic light scattering, Seeded growth process, Photonic crystal
FundProject:
一种可精确控制粒径的SiO2微球合成方法
潘磊,王艺,徐洪波,丁艳波,李垚*,赵九蓬*
摘要:
用改进的种子法合成SiO2微球. 微球生长过程中连续缓慢添加正硅酸乙酯,使用动态光散射法实时监控微球粒径的增长过程,调节正硅酸乙酯的添加,实现对粒径的精确控制. 为制备禁带位置位于1000 nm 的光子晶体,合成粒径为446 nm的SiO2微球,微球粒径在4 h内从193 nm 增长到446 nm,远远快于传统种子法,微球粒径与目标粒径偏差为±5 nm. 制得的SiO2微球被组装为光子晶体,其禁带位置恰好位于1000 nm.
关键词:  SiO2微球,动态光散射法,种子法,光子晶体
DOI:10.1063/1674-0068/27/05/563-567
分类号: