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Wrinkling and Growth Mechanism of CuO Nanowires in Thermal Oxidation of Copper Foil
Fa-chun Lai*,Suan-zhi Lin,Zhi-gao Chen,Hai-long Hu,Li-mei Lin
Author NameAffiliationE-mail
Fa-chun Lai* College of Physics and Energy, Fujian Normal University, Fuzhou 350108, China laifc@fjnu.edu.cn 
Suan-zhi Lin College of Physics and Energy, Fujian Normal University, Fuzhou 350108, China  
Zhi-gao Chen College of Physics and Energy, Fujian Normal University, Fuzhou 350108, China  
Hai-long Hu Analytical and Testing Center, Southwest University of Science and Technology, Mianyang 621010, China  
Li-mei Lin College of Physics and Energy, Fujian Normal University, Fuzhou 350108, China  
Abstract:
We report a systematic study on wrinkling and CuO nanowires (NWs) growth in the thermal oxidation of copper foil. Copper foils with thickness of 0.5 mm were thermally oxidized in air at 500 oC for 0.5-10 h. It is found that all the samples have wrinkles and the size of the wrinkles increases with the oxidation time increasing. CuO NWs can grow on both the sidehill and hilltop of wrinkle. The CuO NWs on sidehill are longer and denser than those on hilltop. The growth direction of the CuO NWs on sidehill is not vertical to the substrate but vertical to their growth surfaces. The process of wrinkling and CuO NWs growth can be divided into three stages: undulating, voiding, and cracking. The CuO NWs on both sidehill and hilltop grow at the undulating stage. However, only the CuO NWs on sidehill grow and those on hilltop stop growing at the voiding and cracking stages because of the void in hilltop. The local electric field in a wrinkle at undulating stage was calculated, and it is found that the difference of local electric field strengths between hilltop and sidehill is small, which indicates that the predominant driving force for the diffusion of Cu ion during CuO NWs growth is internal stress.
Key words:  CuO nanowire, Wrinkling, Thermal oxidation, Growth mechanism
FundProject:
热氧化铜箔中的起皱和CuO纳米线的生长机
赖发春*,林算治,陈志高,胡海龙,林丽梅
摘要:
在500 oC大气条件下热氧化0.5 mm厚的铜箔0.5~10 h有起皱现象,且皱的大小随氧化时间的增加而增大,在皱的侧面和顶部均有生长CuO纳米线,皱侧面生长纳米线的长度比皱顶部的纳米线的长,密度也高;CuO纳米线的生长方向垂直于纳米线的生长表面. 通过计算波动阶段中皱内部的局部电场,发现皱的侧面和顶部的电场强度的数值相差很小,表明在CuO纳米线生长过程中驱动铜离子扩散的主要驱动力不是局部的电场力而是内应力.
关键词:  CuO纳米线,起皱,热氧化,生长机制
DOI:10.1063/1674-0068/26/05/585-589
分类号: