Bonding Parameter Topological Index and Its Application in Correlation with XY, XY₂, XY₃, and XY₄ Molecular Properties

The bonding parameter topological index H_t^± was definded in this paper. Under a given condition, H_t^± becomes the square of the well-known Randic molecular connectivity index. and also, H₁₁ was used to correlate closely with molecular productive enthalpy, lattice enthalpy and cross sections of isomorphic heteroatom molecules.