The Contact Interface and Surface Characters between Multiarc Ion Plating TiN and Different Base Materials

With the technology of multiarc ion plating, the experiments of TiN membrane-plating on the different base materials are carried out, which fabricate TiN/Fe, TiN/Cu and TiN/Cr/Cu compound membranes. The appearances, structures and surface characters of the contact interfaces of TiN and three different underlays, which are Fe, Cu and Cr/Cu, are obtained with the help of the SEM, XRD and XPS. The observation of SEM shows TiN coating and Fe, Cu of Cr/Cu base materials can form the well-distributed and flat contact interface under the certain ion membrane-plating condition. At the same time, there is an apparent interface on the copper material and the obvious distribution of sandwich micro crystallization. The analysis of XRD manifests the membranes shaped on Fe, Cu and Cr/Cu surfaces all contain the heteromorphism such as TiN, Ti2N and so on. It also demonstrates there are some Ti-Cr metal compounds on the Cr/Cu interface. The result of XPS shows the surface also form TiO2and TiOxNyoxidizing membranes besides TiN membrane. After Ar+ etching for five minutes, TiO2disappears, and TiOxNydecreases while TiN increases. The interface of TiN and Cr/Cu shapes palpable Ti-Cr and Cr-Ni mutual diffused layer which is helpful to enhance the adhesion force of membrane and shape firm TiN coating.